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this is information on a product in full production. june 2014 docid026032 rev 1 1/13 ECMF04-4HSWM10 common-mode filter with esd protection for high-speed serial interfaces datasheet - production data figure 1. pin configuration (top view) features ? very large differential bandwidth to comply with hdmi 2.0, usb3.0, mipi, displayport and other high speed serial interfaces ? high common mode attenuation on wlan frequencies: ? 28 db at 2.4 ghz and -16 db at 5.0 ghz ? very good attenuation at lte, gsm and gps frequencies ? large bandwidth: 4.2ghz ? very low pcb space consumption ? thin package: 0.55 mm max. ? lead-free package ? high reduction of parasitic elements through integration complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications ? set top box ? streaming box ? game console ? notebook, laptop ? portable devices description the ECMF04-4HSWM10 is a highly integrated common-mode filter designed to suppress emi/rfi common mode noise on high-speed differential serial buses like hdmi 2.0, usb3.0, ethernet, mipi, displayport and other high-speed serial interfaces. the device has a very large differential bandwidth to comply with these standards and can also protect and filter 2 differential lanes. qfn-10l 2.60 x 1.35 mm 1 2 4 5 10 9 7 6 3 8 d1+ d1- d1+ d1- d2+ d2- d2+ d2- gnd gnd www.st.com
contents ECMF04-4HSWM10 2/13 docid026032 rev 1 contents 1 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 pcb layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
docid026032 rev 1 3/13 ECMF04-4HSWM10 characteristics 13 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge (connector side) air discharge (connector side) 8 15 kv i rms maximum rms current 100 ma t op operating temperature range -40 to +85 c t j maximum junction temperature 125 c t stg storage temperature range - 55 to +150 c symbol parameter v = breakdown voltage br i = leakage current @ v rm rm v = stand-off voltage rm i = breakdown current r i v i rm i r v rm v br table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 4.5 5.5 v i rm v rm = 3 v per line 100 na r dc dc serial resistance 5 f c -3db differential mode cut-off frequency 4.2 ghz
characteristics ECMF04-4HSWM10 4/13 docid026032 rev 1 figure 3. differential attenuation versus frequency (z 0 diff = 100 ) table 3. pin description pin number description pin number description 1 d1+ to connector 6 d2- to ic 2 d1- to connector 7 d2+ to ic 3 gnd 8 gnd 4 d2+ to connector 9 d1- to ic 5 d2- to connector 10 d1+ to ic sdd21 (db) 10m 30m 100m 300m 1g 3g -5 -4 -3 -2 -1 0 f/hz lane #1 lane #2
docid026032 rev 1 5/13 ECMF04-4HSWM10 characteristics 13 figure 4. common mode attenuation versus frequency (z 0 com = 50 ) figure 5. esd response to iec61000-4-2 (+8 kv contact discharge) scc21 (db) 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 lane #1 lane #2 f/hz 20 v/di v 72.1 v 13.1 v 11.2 v 7.1 v 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3
characteristics ECMF04-4HSWM10 6/13 docid026032 rev 1 figure 6. esd response to iec61000-4-2 (-8 kv contact discharge) 20 v/di v 20 ns/di v -65.4 v -10.3 v -9.2 v -3.0 v 1 2 4 3 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 figure 7. hdmi2.0 5.94 gbps eye diagram without ECMF04-4HSWM10 (evaluation board with sma connector) figure 8. hdmi2.0 5.94 gbps eye diagram with ECMF04-4HSWM10 (evaluation board with sma connector)
docid026032 rev 1 7/13 ECMF04-4HSWM10 characteristics 13 figure 11. tdr figure 9. hdmi1.4 3.35 gbps eye diagram without ECMF04-4HSWM10 figure 10. hdmi1.4 3.35 gbps eye diagram with ECMF04-4HSWM10 49.8ps/div 250mv/div 250mv/div 49.8ps/div
application information ECMF04-4HSWM10 8/13 docid026032 rev 1 2 application information figure 12. hdmi schematic figure 13. usb3.0 application hdmi2c1-6c1 d2 clock ecmf04 d0 d1 ecmf04 hdmi connector hdmi asic hdp_ic sda_ic cec_ic scl_ic fault scl gnd cec vdd_cec sda gnd vdd_ic vdd_cfc_ic vdd_5v 5v_out heac- heac+ utility hpd usb 3.0 transceiver connector ecmf02-4cmx8 ECMF04-4HSWM10 programmable ocp vbus d+ d- id gnd txp txn rxp rxn usb2.0 usb3.0
docid026032 rev 1 9/13 ECMF04-4HSWM10 pcb layout recommendations 13 3 pcb layout recommendations figure 14. pcb layout recommendations figure 15. pcb stack dimensions 350 m 350 m 150 m 170 m 170 m 330 m 5000 m connector host pad layout differential lanes (z 0 = 100 ) differential lanes (z 0 = 100 ) 40 m 105 m r = 4.28
package information ECMF04-4HSWM10 10/13 docid026032 rev 1 4 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 16. qfn-10l dimension definitions table 4. qfn-10l dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 2.55 2.60 2.65 0.1 0.102 0.104 e 1.30 1.35 1.40 0.051 0.053 0.055 e 0.50 0.020 l 0.40 0.50 0.60 0.016 0.020 0.024 d idex area top view side view bottom view e a e l b a1 pin # 1 id 1 10 5 6
docid026032 rev 1 11/13 ECMF04-4HSWM10 package information 13 note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 19. tape and reel specifications figure 17. footprint figure 18. marking 0.20 0.50 0. 0 7 1.75 kw dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.00.1 4.0 2.00.05 8.0 +0.3 / -0.1 1.750.1 3.50.05 ? 1.550.05 0.650.05 1.550.05 0.200.05 2.80.05
ordering information ECMF04-4HSWM10 12/13 docid026032 rev 1 5 ordering information figure 20. ordering information scheme 6 revision history ecmf 04 ? 4 hs w m10 function common mode filter with esd protection number if lines 04 = 4 filtered lines number of esd protected lines 4 lines with esd protection version hs = high speed application wlan 2.4 ghz package m10: qfn-10l table 5. ordering information order code marking (1) package weight base qty delivery mode ECMF04-4HSWM10 kw qfn-10l 5.00 mg 3000 tape and reel 1. the marking can be rotated by multiples of 90 to differentiate assembly location table 6. document revision history date revision changes 10-jun-2014 1 initial release.
docid026032 rev 1 13/13 ECMF04-4HSWM10 13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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